The RF magnetron sputtering apparatus is provided with 2 rectangular target with dimension of 50,8 x 143 mm; dimension of the substrate holder 100 x 70 mm and distance between substrate and target of about 250 mm.

A power supply from Advance Energy factory mod. Astral with 200W maximum power and a second power supply from Seren mod. R301MKII is used. SMC Chiller mod. HRS024-AF-20-T is employed for cooling of the targets.

Substrate are placed above the target and can be moved from one to the other target. The temperature of the substrate is monitored.

Alcatel dry primary pump mod. ADP31, Leybold dry primary pump mod. Leyvac LV 80 and Alcatel mag. lev. turbo molecular pump mod. ATH1600 are used.

Vacuum pressure before the deposition is at around 10^-8 mbar and deposition processes are performed in Ar atmosphere at 5.4x10^-3 mbar.